2 days Ago By Lee Jun-sung
SK hynix announced on January 3 that it will showcase its innovative AI memory technology at the Consumer Electronics Show (CES 2025) held in Las Vegas, USA, from January 7 to 10. The event will feature SK hynix's CEO, Noh Jong-kwan, along with Chief Marketing Officer (CMO) Kim Joo-sun and Chief Development Officer (CDO) Ahn Hyun, among other executives. “At CES, we plan to broadly present our AI memory products, including HBM and eSSD, as well as on-device AI optimization solutions and next-generation AI memory technologies," said CMO Kim.
"This will demonstrate our technological competitiveness as a ‘full stack AI memory provider’ and show how we are preparing for the future.” The term ‘full stack AI memory provider’ refers to a company that offers a comprehensive range of AI-related memory products and technologies. Operating under the theme “Innovative AI, Sustainable Tomorrow,” SK hynix will jointly run an exhibition with other SK Group affiliates, including SK telecom, SKC, and SK enmove.
The exhibition will visually depict how SK Group's AI infrastructure and services are transforming the world. Especially, SK hynix is the first company globally to mass-produce the fifth-generation HBM (HBM3E) 12-layer product and will showcase samples of the fifth-generation HBM (HBM3E) 16-layer product at CES. This product employs advanced MR-MUF processing to achieve industry-leading 16-layer technology while preventing chip warping and maximizing heat dissipation performance.
Additionally, high-capacity and high-performance enterprise SSD (eSSD) products will be displayed, including the 122TB model 'D5-P5336' developed by its subsidiary Solidigm, which has attracted significant attention among AI data center customers. Aside from products optimized for AI data centers, SK hynix will introduce on-device AI solutions developed for implementing AI in edge devices like PCs and smartphones, such as 'LPCAMM2' and 'ZUFS 4.0.
' The exhibition will also highlight key technologies for next-generation data centers, including CXL and PIM (Processing in Memory) products. In particular, the CMM-Ax product, which utilizes CXL technology, is gaining attention as an innovative solution that not only offers high-capacity memory expansion but also enhances computational capabilities, significantly improving performance and energy efficiency for next-generation server platforms. “The changes driven by AI are expected to accelerate this year, and SK hynix aims to lead the customized HBM market tailored to customer needs by mass-producing the sixth-generation HBM (HBM4) in the second half of the year,” said CEO Noh Jong-kwan.
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