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SAN JOSE, Calif. , March 26, 2025 /PRNewswire/ -- NextFlex®, America's hybrid electronics manufacturing institute, presented the annual NextFlex Fellow Awards to four deserving individuals in recognition of their exceptional commitment to advanced manufacturing and the additive hybrid electronics member community. A NextFlex Fellow demonstrates leadership and subject matter expertise in support of the NextFlex mission to advance U.
S. manufacturing of flexible and additive hybrid electronics. This year's Fellows include: Tom Rovere, Associate Fellow, Lockheed Martin Paul Gaylo, Supplier Quality Engineer, Lockheed Martin Dr.
David Estrada, Professor of Materials Science and Engineering, Boise State Dr. Charles Ormsby, Director, Materials and Manufacturing Directorate, AFRL "We are deeply grateful for the dedication and expertise of our member volunteers. Their contributions have been crucial in advancing NextFlex's mission and fostering innovation," said Dr.
Daniel Gamota , executive director at NextFlex. "These individuals have shown unwavering commitment, and we thank them for their tireless efforts and leadership as we celebrate an important milestone anniversary. It's exciting to see these new Fellows join the ranks of those recognized over the past 10 years, whose vision and perseverance have guided us to where we are today.
" Each of these individuals is a leader in the NextFlex member community, providing technical guidance on future-leaning roadmaps, contributing to successful hybrid electronics development projects, promoting the benefit of STEM education to the workforce of tomorrow, providing guidance on strategic direction of the institute and representing NextFlex to DoD, industry and academic audiences. These outstanding leaders exemplify what's best about our member community as they drive the NextFlex mission forward. About NextFlex NextFlex is a consortium of companies, academic institutions, non-profits and state, local and federal governments with a shared goal of advancing U.
S. manufacturing of flexible and additive hybrid electronics. Since its formation in 2015, NextFlex's elite team of thought leaders, educators, problem solvers and manufacturers have come together to collectively facilitate innovation, narrow the manufacturing workforce gap and promote sustainable manufacturing ecosystems.
For more information, visit www.nextflex.us and follow NextFlex on LinkedIn .
About hybrid electronics Hybrid electronics give everyday products the power of silicon ICs by combining them with new and unique low-cost and environmentally friendly additive printing processes and new materials, including structural electronics and additive packaging solutions using novel materials. The result is fast time to market, lightweight, low-cost and highly efficient smart products that can be flexible, conformable and stretchable with innumerable uses for consumer, commercial and military applications. This material is based on research sponsored by Air Force Research Laboratory under agreement number FA8650-20-2-5506, as conducted through the hybrid electronics manufacturing innovation institute, NextFlex.
The U.S. government is authorized to reproduce and distribute reprints for governmental purposes notwithstanding any copyright notation thereon.
Contacts NextFlex Karen Savala , 408-797-2219 [email protected] Bospar Caroline Kamerschen [email protected] SOURCE NextFlex.
